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| No.13706444

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Information Name: | Paste action | Zhumadian solder | solder dip |
Published: | 2015-06-12 |
Validity: | 0 |
Specifications: | Any |
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Detailed Product Description: | SMT refers to the printed circuit board pad printing on coated solder paste and surface mount components accurately coated with solder paste onto the pads Zhumadian no-clean solder paste reflow profiles according to specific heating the circuit board, so that the molten solder paste, alloy composition after its cooling and solidification technology achieved metallurgical connection between the component and the printed circuit board pads are formed. Also known as solder paste solder paste, mixed, creamy mixture of solder powder, flux and other additives. Solder paste at room temperature have a certain degree of Bo, the electronic components can tack at a predetermined position, at soldering temperatures Zhumadian no-clean solder paste, with the evaporation of the solvent and the portion of the additive Zhumadian no-clean solder paste, will be wexel devices and printed circuit pads welded together to form a permanent connection. SMT solder paste technology as among important materials, including composition, use, preservation has its own characteristics. Lead-free solder composition, mainly by the tin / silver / copper three parts, silver and copper to replace the original lead of the ingredients. Paste action | Zhumadian paste | paste dip by Zhengzhou City Fujie Soldering Materials Co., Ltd. Zhengzhou City Fujie Soldering Materials Co., Ltd. (www.fujiehanxi.com) (www.fujiehanxi.com) strong, credible, in Zhengzhou, Henan electronics, electrical products processing industry has accumulated a large number of loyal customers. The company better work attitude and constantly improving innovative ideas will lead FUJIE solder into the brilliant and you work for a better future! |
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Copyright © GuangDong ICP No. 10089450, Zhengzhou City, Fu Jie Solder Materials Co., Ltd. All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
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You are the 12229 visitor
Copyright © GuangDong ICP No. 10089450, Zhengzhou City, Fu Jie Solder Materials Co., Ltd. All rights reserved.
Technical support: ShenZhen AllWays Technology Development Co., Ltd.
AllSources Network's Disclaimer: The legitimacy of the enterprise information does not undertake any guarantee responsibility