Under conditions of a certain thickness of the stencil and squeegee hardness, solder recovery by maintaining good edge alignment, solder paste usage, and screen printing templates temperature can be obtained as compared to having a greater thickness of the solder paste layer printed surface tension (adhesion) between the substrate and the solder paste ensures that when blade surface by screen or stencil and squeegee paste is still separated from the circuit board is bonded to the surface of the board. In the printed circuit board fixture circuit board fixed in the process, it is often used to provide this function by a vacuum located below the template drawing board, the purpose of using the vacuum drawing board to the printed circuit board to a process and to provide support to keep it level. SMT refers to the printed circuit board pad printing on coated solder paste, solder paste Zhumadian and accurate surface mount components coated with solder paste onto pads, heating curve according to a specific reflux temperature circuit board, so that the molten solder paste, alloy composition after its cooling and solidification technology achieved metallurgical connection between the component and the printed circuit board pads are formed. Also known as solder paste solder paste, mixed, creamy mixture of solder powder, flux and other additives. Zhumadian paste, Fu Jie solder paste quotes provided by Zhengzhou City Fujie Soldering Materials Co., Ltd. Zhumadian paste, Fu Jie solder paste quoted Zhengzhou City Fujie Soldering Materials Co., Ltd. (www.fujiehanxi.com) (www.fujiehanxi.com) this year introduced a new upgrade, the above picture is for reference only, please dial this Tel pages or pictures on obtain the latest information, contact: Mr. Fung.