Usually inferior solder posing ingredient on the market. Preheat temperature is not enough: adjust the preheating temperature, solder offer, the substrate surface temperature reaches the parts side soldering temperature. On the PC board soldering solder enough time or enough solder furnace operations, Hebi solder, solder general soldering temperature greater than the melting temperature of above 60 degrees. Improper adjustment of flux conditions, such as: height adjustment and foam blowing air compressor used improperly; improper flux spout adjustment. It can be adjusted according to customer usage. The main reason is that the viscosity of fried tin solder flux is too low, the general production control content between 2.0-3.0%. Tin clouds are common specification of 2.0%. Lack to inhibit solvent evaporation rate. Today, I come to find out the specific reasons and specific way to deal with this phenomenon occurred. Hebi solder, FUJIE solder, solder type provided by the Zhengzhou City Fujie Soldering Materials Co., Ltd. Hebi solder, FUJIE solder, solder type Zhengzhou City Fujie Soldering Materials Co., Ltd. (www.fujiehanxi.com) (www.fujiehanxi.com) this year introduced a new upgrade, the above picture is for reference only, please dial this Tel pages or pictures on obtain the latest information, contact: Mr. Fung.